|
主要硬件参数:2 w a, Q; R# t2 g
Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
& c" ? t- j7 O R- r( k1 ^: b4 GB 64-bit wide DDR4 memory
* ^0 Q7 H+ z/ y3 W% }7 B3 V' _Integrated non-volatile memory devices
/ [- s8 c8 f& \) H: ?4 kTPM2.0 security module
) b' S5 h& f& |, r3 pTwo 240-pin connectors with access to user-configurable I/O:
- g( i' d! |6 V1 ~5 yIntegrated and flexible power design& ?/ X8 o% m' E t2 ~$ a
Compact mechanical size with integrated thermal heat spreader |
|