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主要硬件参数:, P% d2 P; }1 g8 R
Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
" ^% y2 g% V0 ^; j7 Y( r4 GB 64-bit wide DDR4 memory, m" p9 T! X! ~/ a8 n& ?
Integrated non-volatile memory devices
% V7 ~) u6 O2 O# ~0 G, c/ D! ITPM2.0 security module) y% B. @/ t) X. T7 a& h
Two 240-pin connectors with access to user-configurable I/O:/ r( s4 e2 a8 E7 M) I: N- q
Integrated and flexible power design
H, T' ^& @% h" R- gCompact mechanical size with integrated thermal heat spreader |
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