|
主要硬件参数:
- ?3 X2 D& k$ W4 ]7 q5 Q! ~Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade), _5 @3 |# N8 }3 l
4 GB 64-bit wide DDR4 memory# L4 M/ J# `2 N0 U
Integrated non-volatile memory devices, h% d9 P+ ^2 b' d9 g i- y
TPM2.0 security module- b3 t6 f& X* o5 `. O0 m
Two 240-pin connectors with access to user-configurable I/O:
, E1 a/ j, k: k k$ UIntegrated and flexible power design
1 D* y! z: z+ u6 ], Z0 J; K' M/ L: Z uCompact mechanical size with integrated thermal heat spreader |
|