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PCB中英对照二、 基材: b! x( w8 A5 n# Q. a, z5 w
3 d b4 t$ m: g1、 基材:base material
9 U: H/ o$ T1 ?0 }) ~2 v% d2、 层压板:laminate
" K2 }# z4 O# H3、 覆金属箔基材:metal-clad bade material
6 k4 }- _: X: o6 B' A3 J) b4、 覆铜箔层压板:copper-clad laminate (CCL) 0 L. u( }* @ l( g+ C7 _
5、 单面覆铜箔层压板:single-sided copper-clad laminate
, H, c) P1 A! a/ K1 I% j6、 双面覆铜箔层压板:double-sided copper-clad laminate
+ y4 v- ~1 D$ D7、 复合层压板:composite laminate 7 K, Z" b* `$ g' ], o' i
8、 薄层压板:thin laminate
! o. u/ d1 c/ X4 A" L9、 金属芯覆铜箔层压板:metal core copper-clad laminate
# l0 z; n& N3 y9 x9 C' L10、 金属基覆铜层压板:metal base copper-clad laminate # S- g. ^: s+ A* x ]1 }2 B* J( y
11、 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
/ h2 q: U( ~# y! A12、 基体材料:basis material ; | F* R9 J! [
13、 预浸材料:prepreg % J: |& f& H7 A9 H7 c; }) [7 r3 H% R
14、 粘结片:bonding sheet
% t2 T* ~* F' n15、 预浸粘结片:preimpregnated bonding sheer
7 T) H* g+ g6 P16、 环氧玻璃基板:epoxy glass substrate
, {/ O+ Q7 d' n* w17、 加成法用层压板:laminate for additive process
/ e* P r y+ K9 Y6 c2 a+ N& X18、 预制内层覆箔板:mass lamination panel " T; n: u7 c6 M. j; G
19、 内层芯板:core material j3 h% w! w1 h U+ K& @% K( B
20、 催化板材:catalyzed board ,coated catalyzed laminate 1 C8 @* _% j2 O2 ^2 H" h
21、 涂胶催化层压板:adhesive-coated catalyzed laminate * L9 Y. ^2 T% v" o- ]- k9 O* ^
22、 涂胶无催层压板:adhesive-coated uncatalyzed laminate ; X1 O* L2 q, `8 u/ n6 J8 m
23、 粘结层:bonding layer P+ l4 S7 Y% H* k
24、 粘结膜:film adhesive `# i7 ~$ f% B5 c
25、 涂胶粘剂绝缘薄膜:adhesive coated dielectric film 2 U/ B. ? ?$ U' x! Y& w
26、 无支撑胶粘剂膜:unsupported adhesive film , ?3 G: X" ^) A1 V
27、 覆盖层:cover layer (cover lay)
: |, d: c0 E+ i, j& o+ \28、 增强板材:stiffener material * }/ V: U! |* [
29、 铜箔面:copper-clad surface
' s% H* \& i0 u1 D( o30、 去铜箔面:foil removal surface
N! x& }9 J% q. B% @3 g31、 层压板面:unclad laminate surface
3 W- L. ]8 U' V }) m1 A2 r32、 基膜面:base film surface
# p0 y- f- v8 M% W6 O! O) e! D. b33、 胶粘剂面:adhesive faec , L# j; D; V/ V6 Z4 Z- l# c
34、 原始光洁面:plate finish : M+ }. i' i/ h" @( Q0 D: L: D
35、 粗面:matt finish
( N$ I% ?: _8 \! M5 n36、 纵向:length wise direction 5 q" q5 c- |$ G% Z$ d
37、 模向:cross wise direction * u! i s; G! e* `
38、 剪切板:cut to size panel
k# _! t" q2 @- P4 i2 W39、 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 7 l+ h0 W' q B0 c6 Z. I
40、 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) ' s! Q7 h! k. ^$ {* X% Q+ L
41、 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates
) D/ [ [3 ~# i/ B! m! W7 f42、 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
+ h, I e% ]+ K; ~; z5 R43、 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates 6 E' c: }8 r) |$ z# Q" U5 p" ?
44、 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates - z7 h* j8 M( r: z
45、 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
- {+ w' K) v! p- f46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
: s6 k$ d( O) D) I47、 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates / g6 \) W9 V$ q: P. P: ^$ ~3 H& X
48、 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates 8 d! A' b( F. Z X7 W" ]
49、 超薄型层压板:ultra thin laminate
0 D( `4 a' m+ Q50、 陶瓷基覆铜箔板:ceramics base copper-clad laminates
' y3 r- a1 c0 \8 G51、 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates , `7 W- S: A! v; E6 j
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