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PCB中英对照二、 基材: j" j" n2 S6 i' F4 t5 F* y
1 x7 {3 D* M5 a$ R' z1、 基材:base material
- K& q% B i# R7 _$ Z0 p1 E2、 层压板:laminate " [; E% Y' s& U* o
3、 覆金属箔基材:metal-clad bade material ) @+ c& r. s6 I1 X+ \ @9 V) f- t
4、 覆铜箔层压板:copper-clad laminate (CCL) 1 i; j5 _9 a- Y; ?# V" ]
5、 单面覆铜箔层压板:single-sided copper-clad laminate
- ]# ^* t8 I+ |6 G( v6、 双面覆铜箔层压板:double-sided copper-clad laminate - K$ Q) ~/ |5 z, ^1 G) w
7、 复合层压板:composite laminate ) a6 V, g, y9 [, o/ a3 P) \5 X
8、 薄层压板:thin laminate
! M' Y4 @0 }. T8 m- N5 t& e9、 金属芯覆铜箔层压板:metal core copper-clad laminate
2 w9 u5 R* i+ p6 g) }10、 金属基覆铜层压板:metal base copper-clad laminate
* e/ C1 b1 X; V5 v3 [5 ~) X8 q11、 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film
+ ^# \( t( \6 x1 t& [2 V H12、 基体材料:basis material ; ^6 p* J2 H8 M. B! l& I
13、 预浸材料:prepreg
" ~& b7 o+ ~8 |+ `14、 粘结片:bonding sheet
- U( ^, ~% [: B! Q0 P! o2 Q15、 预浸粘结片:preimpregnated bonding sheer
9 |9 f) z2 @) Y4 H) C16、 环氧玻璃基板:epoxy glass substrate a6 @, i0 f) Z
17、 加成法用层压板:laminate for additive process / E# F3 Z! ]1 H7 A2 Q$ F
18、 预制内层覆箔板:mass lamination panel ; T1 a; T8 |# z
19、 内层芯板:core material 1 |* J8 i; J# W T j$ G
20、 催化板材:catalyzed board ,coated catalyzed laminate
* j0 R3 O6 w2 a8 Q21、 涂胶催化层压板:adhesive-coated catalyzed laminate , E% x; N; k# ^2 z5 x
22、 涂胶无催层压板:adhesive-coated uncatalyzed laminate
v7 L* F7 z4 X, t) }+ }. |5 g23、 粘结层:bonding layer
' i, q9 e6 P" u3 i, r* `, @1 M7 v, _24、 粘结膜:film adhesive
6 O: \3 g- Z3 `5 _+ Y1 C1 N25、 涂胶粘剂绝缘薄膜:adhesive coated dielectric film
- q3 N6 o. B; N/ m. N$ C26、 无支撑胶粘剂膜:unsupported adhesive film
: p- w' h R8 i3 f3 Z27、 覆盖层:cover layer (cover lay)
' `. T3 G2 q" j" ~) F9 N/ L28、 增强板材:stiffener material " x4 c0 s# L* A( Q/ J" f$ T
29、 铜箔面:copper-clad surface 7 v/ ~2 A& D% D
30、 去铜箔面:foil removal surface + v+ _( L; k( w& a
31、 层压板面:unclad laminate surface
/ K4 V) P+ j' y8 Q- q0 n4 W/ v& u32、 基膜面:base film surface
$ R% L3 w2 E( G& ]4 |$ }! W4 |33、 胶粘剂面:adhesive faec
; s5 X' I2 C/ V3 ?$ ^5 {; T34、 原始光洁面:plate finish + E$ E0 [* y, E& `1 c
35、 粗面:matt finish . N+ f7 b/ v3 G* v& n+ R7 u# `/ q
36、 纵向:length wise direction
( P8 R G! M* K* [37、 模向:cross wise direction - t; S9 k+ b5 V
38、 剪切板:cut to size panel
: [' c) [8 ?- r) p$ ]* q39、 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) / n# u8 Z/ `! q& w% j8 l
40、 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
2 m7 p- k# N6 K( W) q o! s/ H* }% ^41、 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates $ {' j% K$ `2 L7 J( d! H0 S) d
42、 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates - N9 l4 A/ `$ q# C4 P4 Z/ S0 t
43、 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
9 x$ l Y8 _' ~44、 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates $ U( V+ Y" k. [( y
45、 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 7 L. q; o( E+ l3 ?% Y3 P
46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates $ R x1 [5 X& f9 z Y- p- N) L) |
47、 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
* g* {8 G4 A- a, @3 W8 b48、 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
( |8 M, f/ T) Y; T8 I# ^49、 超薄型层压板:ultra thin laminate + z& L, a& i4 b {* @' |
50、 陶瓷基覆铜箔板:ceramics base copper-clad laminates $ l* `0 v- I/ X6 m% V$ v1 X* |
51、 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates + U# q* j. @; x5 J8 e; X: g& Z
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